Description
Overview
TechLevel WSF is a fiber-reinforced, calcium-aluminate self-leveling underlayment specifically designed to eliminate reinforcing lath over suitable interior plywood and OSB subfloors. It creates a smooth, level base for tile, wood, carpet and resilient floor coverings in nominal pours from 1/4 to 1-1/2 inches.
Features
- Fiber reinforcement eliminates separate lath in the specified wood-floor assembly.
- Compatible with most radiant heating systems under the manufacturer’s details.
- High-flow, low-prep formula; extra-heavy service rating on concrete under ASTM C627.
Specifications
- Package: 50 lb.
- Single-pour range: 1/4–1-1/2 in.
- Coverage at 1/4 in.: 22–22.7 sq. ft. per bag
- At 1/2 in.: 11–11.4 sq. ft.
- At 1 in.: 5.5–5.7 sq. ft.
- At 1-1/2 in.: 3.6–3.7 sq. ft.
Downloads
Applications
Choose WSF when a compatible wood subfloor needs leveling without adding reinforcing lath. The listed wood assembly starts with APA-rated 3/4-inch tongue-and-groove exterior-exposure plywood or OSB equivalent over 16-inch joist spacing for most finishes.
Selection and Use
- Correct loose panels, deflection and structural deficiencies before leveling. Natural stone, Saltillo, cement tile and glass can require another plywood layer or additional support; the no-lath feature does not remove those requirements.
- Clean and prime the substrate. Existing tile, terrazzo, gypsum underlayment and adhesive residue need their own preparation details.
- Non-moisture-sensitive tile or stone can typically follow after 4 hours; other coverings after 16 hours, subject to cure conditions and the flooring adhesive’s moisture limits.
- Use indoors, cover with finish flooring and do not pour where a drainage slope must be maintained. Confirm radiant-system details before encapsulation.